Journal of The Electrochemical Society · 2001 · 60 citations · 7 references
Natural SciencesMaterials EngineeringMaterials ScienceElectrochemical EngineeringElectrochemistryMaterials ChemistryElectrochemical TreatmentElectrode MaterialsIndustrial ElectrochemistryMetalsPolishing OperationsPowder MetallurgyMechanical PolishingPolishingPolishing Processes
A general model of chemical mechanical polishing (CMP) has been derived which shows the dependence of the polishing rate on the concentration of chemicals and abrasives in the slurry. This paper applies the model to tungsten CMP and describes the chemistry of tungsten CMP in some detail. © 2001 The Electrochemical Society. All rights reserved.
7
A Model of Chemical Mechanical Polishing
Ed Paul · Journal of The Electrochemical Society · 2001 · 78 citations · Full text