Thermochemical and phase diagram studies of the Sn–Zn–Ni system

High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seongjun Kim, Keun‐Soo Kim · JOM · 2009 · 347 citations

Natural Sciences, Materials Engineering, Materials Science +10

A new investigation of the system Ni–Sn

Clemens Schmetterer, Hans Flandorfer, Klaus W. Richter et al. · Intermetallics · 2006 · 240 citations

Natural Sciences, Materials Science, Electronic Materials +1

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12

Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

Seongjun Kim, Sun‐Sik Kim, Katsuaki Suganuma · Journal of Electronic Materials · 2008 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +16

Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder

Jae-Ean Lee, Keun‐Soo Kim, Katsuaki Suganuma et al. · MATERIALS TRANSACTIONS · 2007 · 110 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17