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An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware ReliabilityLow-cycle FatigueMechanical EngineeringPower ModulesCircuit ReliabilityElectronic PackagingDevice ReliabilityThermal EngineeringAeronautical ApplicationsPhysic Of Failure