Publication | Closed Access
Time domain analysis of skin effect on lossy interconnections
16
Citations
2
References
1990
Year
EngineeringWearable TechnologyInterconnect (Integrated Circuits)Electromagnetic CompatibilityWear TestingMechanicsComputational ElectromagneticsElectronic PackagingTime Domain AnalysisCircuit AnalysisElectrical EngineeringResistive Ground PlaneInterfacial ProcessPropagation ParametersGround PlaneMicroelectronicsMicrofabricationTransmission LineElectrical Insulation
A new skin effect equivalent circuit has been presented in a previous work where the ground plane has been considered as a prefect conductor. In this letter, the loss due to the returning current in a resistive ground plane is accounted for. A modified skin effect equivalent circuit is presented and analysed by SPICE to obtain the propagation parameters as a function of frequency. This equivalent network is analysed in the time domain. Responses obtained have good agreement with those given by other methods.
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