The role of oxide layers in solder joints

Transport processes during the growth of oxide films at elevated temperature

A. Atkinson · Reviews of Modern Physics · 1985 · 756 citations

Natural Sciences, Materials Engineering, Materials Science +16

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

Engineering, Materials Engineering, Materials Science +10

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

The diffusion of⁶³Ni along grain boundaries in nickel oxide

A. Atkinson, R. I. Taylor · Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties · 1981 · 303 citations

Natural Sciences, Materials Engineering, Materials Science +14

Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

Hua Zou, H.J. Yang, Z.F. Zhang · Acta Materialia · 2008 · 202 citations

Engineering, Materials Engineering, Materials Science +16