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Modeling of charging effect and its correction by EB mask writer EBM-6000
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2008
Year
Electrical EngineeringEngineeringElectron-beam LithographyBeam LithographyApplied PhysicsComputer EngineeringUpcoming Lithography GenerationsBeam Position ErrorComputational ElectromagneticsElectrical Engineering TechnologyPattern Placement AccuracyMicroelectronicsOptoelectronicsNanolithography MethodElectrical InsulationElectromagnetic Compatibility
The impending need of double patterning/double exposure techniques is accelerating the demand for higher pattern placement accuracy to be achieved in the upcoming lithography generations. One of the biggest error sources of pattern placement accuracy on an EB mask writer is the resist charging effect. In this paper, we provide a model to describe the resist charging behavior on a photomask written on our EBM-6000 system. We found this model was very effective in correcting and reducing the beam position error induced by the charging effect.