Exact thermal representation of multilayer rectangular structures by infinite plate structures using the method of images

Abstract

Using the method of images and the analytical temperature solution to the multilayer infinite plate structure, the thermal profile over finite rectangular multilayer integrated circuit devices can be calculated exactly. The advantage of using the image method lies in the enhanced capability of arriving at an analytical solution for structures where analytical solutions do not apparently exist, e.g., circular or arbitrarily oriented rectangular sources over multilayered rectangular structures. The new approach results in large savings in computer CPU time especially for small sources over large substrates. The method also finds very important applications to integrated circuit devices with heat dissipating elements close to the edge boundaries. Results from two examples indicate that the edge boundaries of a device may also be utilized to remove heat from it. This additional heat removing capability should have important applications in high power devices.