Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map - Concepedia

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Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map

25

Citations

21

References

2011

Year

Praveen Kumar, Zhe Huang, I. Dutta, R. Sidhu, M. Renavikar, Ravi Mahajan

Journal of Electronic Materials

Materials ScienceMaterials EngineeringEngineeringCorrosionMechanical EngineeringMetallurgical InteractionFracture Mechanism MapCu SubstratesSn-ag-cu Solder JointsMechanics Of MaterialsMicrostructure

References

	Year	Citations

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