Effect of iron(III) nitrate concentration on tungsten chemical-mechanical-planarization performance

Nature of the use of adventitious carbon as a binding energy standard

Tery L. Barr, Sudipta Seal · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1995 · 764 citations

X-ray Spectroscopy, Engineering, Computational Chemistry +23

Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects

F. B. Kaufman, Daniel B. Thompson, R. E. Broadie et al. · Journal of The Electrochemical Society · 1991 · 506 citations

Engineering, Mechanical Engineering, Chip Interconnects +19

Effect of Particle Size during Tungsten Chemical Mechanical Polishing

M. Bielmann · Electrochemical and Solid-State Letters · 1999 · 135 citations

Engineering, Mechanical Engineering, Tungsten Polishing +16

In Situ Electrochemical Investigation of Tungsten Electrochemical Behavior during Chemical Mechanical Polishing

David J. Stein, Dale L. Hetherington, T.R. Guilinger et al. · Journal of The Electrochemical Society · 1998 · 81 citations

Tungsten Removal, Engineering, Tungsten Electrochemical Behavior +18

Electrochemistry of Chemical Vapor Deposited Tungsten Films with Relevance to Chemical Mechanical Polishing

E. A. Kneer, Raghunath Chilkunda, Srini Raghavan et al. · Journal of The Electrochemical Society · 1996 · 72 citations

Engineering, Electrode-electrolyte Interface, Tungsten Films +18