Sn deposition onto Cu and alloy layer growth by a contact immersion process

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 485 citations

Natural Sciences, Materials Engineering, Materials Science +10

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

Underpotential alloy formation in the system Ag(hkl)/Cd2+

H. Bort, K. Jüttner, W.J. Lorenz et al. · Electrochimica Acta · 1983 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +14

Diffusion at Au(100)/Cd2+ interface during electrodeposition

Ruxandra Vidu, Shigeta Hara · Surface Science · 2000 · 37 citations

Natural Sciences, Chemistry, Materials Science +10

Alloying of a Less Noble Metal in Electrodeposited Cu Through Underpotential Deposition

Jean Horkans, I‐Chia Hsu Chang, P. C. Andricacos et al. · Journal of The Electrochemical Society · 1995 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +15