Lift-out techniques coupled with advanced TEM characterization methods for electrical failure analysis - Concepedia

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Lift-out techniques coupled with advanced TEM characterization methods for electrical failure analysis

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References

2002

Year

N. Bicaı̈is-Lépinay, Frederic André, R. Pantel, S. Jullian, A. Margain, L.F.Tz. Kwakman

Microelectronics Reliability

Electrical EngineeringReliability EngineeringEngineeringNondestructive TestingElectrical Failure AnalysisStructural Health MonitoringFailure AnalysisLift-out TechniquesEngineering Failure AnalysisCircuit ReliabilityElectronic PackagingMicroelectronicsPhysic Of FailureElectrical Insulation

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