IEEE Journal of Quantum Electronics · 1989 · 114 citations · 15 references
EngineeringElectrical EngineeringMaterials ScienceHeat TransferMicroelectronicsSemiconductor DevicesHeat Transfer AnalysisHeat Transfer FundamentalsLaser DiodesLaser PhysicsSemiconductor LasersThermal Properties Of SemiconductorsExternal Cavity Laser DiodesHeat Sink DesignHeat SinksHigh-power Laser DiodesHigh-power Semiconductor LasersMicrochannel Heat TransferThermal Management In Semiconductor LasersThermal Resistance
The operation of a two-dimensional GaInAsP/InP diode laser array with CW power dissipation up to 500 W/cm/sup 2/ into a Si microchannel heat sink is discussed. The approximately 1*4-mm/sup 2/ laser array was used to characterize the heat sink, and the value of 0.040 degrees C cm/sup 2//W was obtained for the thermal resistance per unit area. The extrapolated value for a 1-cm/sup 2/ heated area is 0.070 degrees C cm/sup 2//W.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Thermal resistance of heterostructure lasers
W. B. Joyce, R. W. Dixon · Journal of Applied Physics · 1975 · 278 citations
R. J. Phillips · 1988 · 191 citations
Engineering, Materials Engineering, Mechanical Engineering +15