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Electrical and physical properties of HfO2 films prepared by remote plasma oxidation of Hf metal
67
Citations
11
References
2003
Year
EngineeringOxidation ResistanceRemote Plasma OxidationChemistryPlasma ProcessingPhysical PropertiesHfo2 FilmsNanoelectronicsHfo2 CapacitorsHafnium MetalNonthermal PlasmaMaterials ScienceMaterials EngineeringThin Hafnium OxideOxide ElectronicsHydrogenMicroelectronicsElectrochemistrySurface ScienceApplied PhysicsGas Discharge Plasma
The electrical and physical properties of thin hafnium oxide (HfO2) films fabricated by a remote plasma oxidation of a hafnium metal were investigated. The HfO2 capacitors with TiN electrodes exhibited excellent electrical characteristics such as equivalent oxide thickness (EOT) of 0.65 nm with leakage current density of 2.7 A/cm2 at the gate bias of Vfb-1 (V). The HfO2 thickness dependence of the EOT demonstrated that the permittivity of 19 for HfO2 layer and the interfacial layer thickness of 0.36 nm. X-ray photoelectron spectroscopy study revealed that the oxygen radicals oxidize the Hf metal selectively than Si substrate, leading to an increase of permittivity of HfO2 with reduced interfacial layer growth.
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