Publication | Closed Access
Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures
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Citations
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References
2005
Year
Materials ScienceMaterial AnalysisEngineeringSuperalloySevere Plastic DeformationMicrofabricationMechanical EngineeringApplied PhysicsImpression Creep CharacterizationMaterial PerformanceSupersolvus TemperaturesElectronic PackagingMicrostructure
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