IEEE Journal of Solid-State Circuits · 2014 · 59 citations · 19 references
EngineeringComputer EngineeringElectrical EngineeringAnalog ElectronicsDigital CommunicationSystem-on-chip DesignCmos Circuit DesignDigital Integrated Circuit DesignDynamic Power ReductionLow-power Digital Circuit DesignMixed-signal Integrated Circuit DesignMixed-signal IntegrationConnector DesignEqualizationJitter ReductionPower ConsumptionReceiver ArchitectureSilicon
This paper details the design of an 8-lane bidirectional link for both within-the-box and external communications in 22 nm CMOS technology. A low profile connector with a high density cable assembly ensure a data rate of up to 32 Gb/s per lane while maintaining channel loss below 25 dB. Channel equalization is performed by a combination of a 3-tap feed-forward equalizer (FFE), single-stage continuous-time linear equalizer (CTLE) and a 6-tap decision-feedback equalizer (DFE). Collaborative timing recovery is used to enable lane characterization without degrading jitter performance. Phase error decimation, with a conditional phase detection scheme, is used to reduce the DFE complexity by 50%. Power consumption over a wide range of data rates from 4 to 32 Gb/s is reduced by using regulated CMOS clocking with lane bundling, low swing transmitter with a source-series terminated (SST) driver and a highly reconfigurable receiver with an active inductor CTLE. At a lane data rate of 32 Gb/s, over a 0.5 m cable with 16 dB of loss, a transceiver lane consumes 205 mW from a 1.07 V supply. The power scales down to 26 mW from a 0.72 V supply at 8 Gb/s, when transmitting over a channel with 8 dB loss. The active silicon area per lane is 0.079 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .
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A 27-mW 3.6-Gb/s I/O Transceiver
K.-L.J. Wong, Hamid Hatamkhani, Mozhgan Mansuri et al. · IEEE Journal of Solid-State Circuits · 2004 · 121 citations
Engineering, Computer Engineering, Electrical Engineering +17
Hiroshi Kimura, Pervez Aziz, Tai Jing et al. · IEEE Journal of Solid-State Circuits · 2014 · 96 citations · Full text