Fabrication of Sn-Cu alloy solder by pulse electroplating on the metalized Si wafer

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Materials Science, Interfacial Reactions, Engineering +4

Optical properties of epitaxial and polycrystalline Sr[sub 1.8]Ca[sub 0.2]NaNb[sub 5]O[sub 15] thin-film waveguides grown by pulsed laser deposition

W. C. Liu, Chee Leung Mak, Kin-hung Wong et al. · PolyU Institutional Research Archive (Hong Kong Polytechnic University) · 2006 · 165 citations · Full text

Materials Science, Photonics, Epitaxial Growth +10

Properties of low melting point Sn–Zn–Bi solders

Jian Zhou, Sun Yangshan, Feng Xue · Journal of Alloys and Compounds · 2005 · 146 citations

Materials Engineering, Materials Science, Engineering +5

Sn–Zn low temperature solder

Katsuaki Suganuma, Kuen-Soo Kim · Journal of Materials Science Materials in Electronics · 2006 · 142 citations

Materials Engineering, Materials Science, Engineering +3

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Journal of Applied Physics · 2006 · 121 citations

Materials Engineering, Materials Science, Electrical Engineering +15