Thermomechanical behaviour of adhesive jointed SMT components

Abstract

This paper compares the efficiency of two thermosetting and one thermoplastic conductive adhesives for SMT assemblies. Their reliability is evaluated during accelerated life tests through electrical and mechanical measurements. The contact metallizations are taken into account. Finite element simulations confirm the experimental results, and a parametric study allows us to define some choice criteria for the physical properties of the adhesives.