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The influence of the layout on the ESD performance of HV-LDMOS

28

Citations

4

References

2010

Year

Abstract

The root causes of the high voltage (HV) LDMOS (Fig. 2) failed at the low voltage electrostatic-discharge (ESD) zap is found. One is caused by the bulk layout and one is caused by the intrinsic characteristic of the device. From the findings, a new structure is proposed to eliminate the root causes without sacrificing the IV characteristics and dimension of the device.

References

YearCitations

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