CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process - Concepedia

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CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process

13

Citations

5

References

2005

Year

J. J. McMahon, Frank Niklaus, Ravi Kumar, Junrong Yu, Jian‐Qiang Lu, R.J. Gutmann

MRS Proceedings

Materials Science3D Ic ArchitecturePartially Cured BenzocyclobuteneEngineeringCmp CompatibilityNatural SciencesVia-first 3D3D IntegrationChemistryMicroelectronics3D Printing

References

	Year	Citations

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