2002 · 15 citations · 1 references
EngineeringElectrical EngineeringManufacturing EngineeringMicroelectronicsPackaging DesignSemiconductor DevicesChip PackagingDesign For TestabilityDevice ReliabilityIntegrated Circuit DesignPackaging EngineeringSemiconductor ReliabilityBurn-in TestingDevice Burn-inDie ArchitectureDie DesignDie-to-wafer BondingPackage ReliabilityWafer-level PackagingYield Enhancement
Multichip packaging applications require bare die with high yield and reliability. Die-Level (test &) Burn-In (DLBI) approaches are just emerging. Targeting temporary die carrier development and application. In addition, strategic goals of IC manufacturers are driving development of Wafer-Level (test &) Burn-In (WLBI) to support more rapid reliability learning in manufacturing. This paper provides a critical look at the emerging KGD technology solutions with focus on temporary die carriers.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Wafer burn-in (WBI) technology for RAM's
T. Furuyama, N. Kushiyama, H. Noji et al. · 2002 · 12 citations
Engineering, Computer Engineering, Electrical Engineering +17