Known-good-die technologies on the horizon

Abstract

Multichip packaging applications require bare die with high yield and reliability. Die-Level (test &) Burn-In (DLBI) approaches are just emerging. Targeting temporary die carrier development and application. In addition, strategic goals of IC manufacturers are driving development of Wafer-Level (test &) Burn-In (WLBI) to support more rapid reliability learning in manufacturing. This paper provides a critical look at the emerging KGD technology solutions with focus on temporary die carriers.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>