The inductive connection effects of a mounted SPDT in a plastic SO8 package

Abstract

An investigation of the electrical performance of an assembled SO8 package with a single-pole, double-throw (SPDT) switch is presented. Using an equivalent electric network for the whole assembly, the isolation and the insertion losses are computed for a signal frequency up to 5 GHz. From the modeling and simulation results, a significant effect of the path connection to ground is shown, and the required modifications of the connecting layout are discussed. The modeling concept is applicable to any single-chip package.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>