IEEE Electron Device Letters · 2015 · 52 citations · 17 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationMetal-semiconductor ContactsSemiconductor Device MaterialsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBreakdown VoltageDevice FabricationEtchingForward Bias CharacteristicsGallium Nitride (Gan) MaterialsGallium Nitride Power DevicesSchottky Barrier CharacteristicsSchottky Barrier Diodes
A large GaN-Schottky barrier diode (SBD) with a recessed dual anode metal is proposed to achieve improved the forward characteristics without a degradation of the reverse performances. Using optimized dry etch condition for a large device, the electrical characteristics of the device are demonstrated when applying the recessed dual anode metal and changing the recess depths. The device size and channel width are 4 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and 63 mm, respectively. The 16-nm recessed dual anode metal SBD has a turn- <bold xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</b> voltage of 0.34 V, a breakdown voltage of 802 V, and a reverse leakage current of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1.82~\mu \text{A}$ </tex-math></inline-formula> /mm at −15 V. The packaged SBD exhibits a forward current of 6.2 A at 2 V and a reverse recovery charge of 11.54 nC.
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Y. Saitoh, Kazuhide Sumiyoshi, Masaya Okada et al. · Applied Physics Express · 2010 · 260 citations
1.9-kV AlGaN/GaN Lateral Schottky Barrier Diodes on Silicon
Mingda Zhu, Bo Song, Meng Qi et al. · IEEE Electron Device Letters · 2015 · 184 citations · Full text