2002 · 10 citations · 3 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMaterials ChemistrySemiconductor DevicesDefects In Electronic MaterialsImplant MaterialsIon ImplantationMetal-semiconductor ContactsSemiconductor DefectsSemiconductor ReliabilityAnomalous DiffusionAnomalous Diffusion EffectsJunction ResistanceSheet ResistanceTechnology Roadmap Integration
We have investigated the limits on sheet resistance, junction depth and abruptness using ultra low energy As implants and RTA annealing. We report on anomalous diffusion of 1 keV arsenic implants where the same RTA anneal can result in a deeper junction compared to a 5 keV implant of similar dose. A range of anneal times and temperatures in an RTA from 1020C to 1175C, including spike anneals, have been studied. The effect of junction abruptness in reducing the external resistance of the S/D extension for these 5 and 1 keV As implants has been investigated. We show that because of a trade off between junction depth and sheet resistance limits, 1 keV As implants and RTA anneals cannot meet the technology roadmap requirements beyond 2005, though the junction abruptness will meet the requirements till 2011.
3
Characterization of arsenic dose loss at the Si/SiO2 interface
Reza Kasnavi, Yun Sun, Renee Mo et al. · Journal of Applied Physics · 2000 · 45 citations
Natural Sciences, Materials Engineering, Materials Science +17