EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringPackaging DesignMicrostrip CircuitsMicrowave PackagingTransmission LinesCrosstalk Noise MitigationHigh-speed Circuit DesignHigh-speed TransmissionMaximum SpeedMicrostrip Transmission LinesPackaging System DesignSignal Transmission
A printed-circuit-board connector meeting the requirements of fast pulse-signal transmission in the gigabits-per-second range has been developed. Flexible printed-circuit film with a microstrip line configuration is used for the connector leads. The electrical design procedure for the connector first focuses on reducing the reflection noise and then considers other types of noise. A packaging system using the connector is shown to have excellent electrical characteristics: the maximum pulse-signal speed is 1.5 Gb/s (NRZ signal), and crosstalk on the nearest leads is below 5% (for a 300-ps pulse rise and fall time). The speed is about 3-5 times as great as for conventional connectors.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Transmission and Propagation of Electromagnetic Waves
P.S. Hall · Electronics and Power · 1979 · 18 citations
Packages for ultra-high speed GaAs ICs
T. Gheewala · Microelectronics Journal · 1985 · 12 citations
Engineering, Computer Engineering, Electrical Engineering +17