Publication | Closed Access
Microchannel heat sinks
191
Citations
0
References
1988
Year
Unknown Venue
Heat Transfer ProcessEngineeringLiquid Metal CoolingMicrofabricationHeat ExchangerHeat LoadsHeat Transfer EnhancementApplied PhysicsPorous MediaMicroelectronicsMicrochannel Heat SinksThermodynamicsHeat TransferHeat SinksMicrofluidicsThermal EngineeringHeat PipeRefrigeration
Microchannel heat sinks useful in the cooling of diode laser arrays have been fabricated from InP and exhibit a thermal resistance as low as 0.072 C/(W/sq cm), corresponding to the dissipation of heat loads in excess of 1 kW/sq cm and representing a two-orders-of-magnitude reduction of levels achievable by current methods. The pumping power required to force liquid coolants through microchannel heat sinks can be kept as low as as 10 W/sq cm. Attention is presently given to a thermal- and fluid-performance model for these heat sinks, as well as to illustrative examples of microchannel fabrication for both InP and aluminum. 19 references.