Wire-length distribution of three-dimensional integrated circuits

Abstract

In this paper, the wire (interconnect)-length distribution of three-dimensional (3D) integrated circuits is derived following the methodology used to estimate two-dimensional wire-length distribution (Davis et al, 1998). It is found that 3D integration results in a narrower wire-length distribution with a higher number of local wires and fewer global wires than 2D integration. The impact of 3D integration on system performance is discussed.