Creep of thermally aged SnAgCu-solder joints

Abstract

The scope of the paper is to present creep data that was obtained from different specimens. It will be shown that the creep behaviour of SnAgCu-solder differs by specimen size and its manufacturing conditions. The paper focuses on the change of creep behaviour as a consequence of thermal aging of the solder. It compares the creep behaviour in the as-cast condition of the alloy with that after thermal storage for 24 h, 168 h and 1176 h at a temperature of 125/spl deg/C. In addition the paper will point out the effect of different pad metallizations onto creep properties. The paper provides constitutive models for SnAg- and SnAgCu-solders in dependence on the type of pad metallization and aging condition.