Impact of solder fatigue on module lifetime in power cycling tests

Abstract

Different end-of-life mechanisms in power modules (i.e., solder fatigue and wire bond failures) and their interactions are subject of investigation. Their contribution to the lifetime limit is especially relevant for the extrapolation of accelerated endurance test results to application conditions. The comparison of Ag-diffusion sintered modules with traditional soldered modules allows investigating the influence of solder fatigue on the lifetime of power modules under active power cycling.