2002 · 95 citations · 4 references
EngineeringCommunicationElectrical EngineeringDigital CommunicationMicroelectronicsWireless CommunicationsCmos Circuit DesignComplementary Metal-oxide-semiconductor TechnologyIntegrated Circuit DesignMixed-signal Integrated Circuit DesignMixed-signal IntegrationRadio-frequency Integrated CircuitsCmos Analog Circuit DesignCmos Analog Integrated CircuitsCmos Radio-frequency CircuitsRadio Frequency Front-end IntegrationRadio-frequency Integrated Circuit DesignRf Cmos DesignTransceiver ArchitecturesWireless Communication Systems
This CMOS transceiver chip for the DCS-1800 wireless communication system is realized in a 0.25 /spl mu/m CMOS process. The realization of a CMOS transceiver that complies with the specifications of a high-quality digital-wireless system requires overall integration of architecture, building block and transistor-level design. A highly-integrated architecture minimizes the number of high-frequency external nodes, as these are difficult to drive with CMOS circuits. Up- and downconversion topologies allow at the same time mixing and a high-quality on-chip single-ended to differential conversion. Extra buffers between building blocks optimize overall circuit performance.
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