Publication | Open Access
Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology
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Citations
3
References
2010
Year
Unknown Venue
Electrical EngineeringEngineeringMems SwitchesRf SemiconductorMicrofabricationAdvanced Packaging (Semiconductors)Successful IntegrationReliability AspectsRf Mems CircuitsRf MemsElectronic PackagingMicroelectronicsMicrowave EngineeringMicro-electromechanical SystemRf Subsystem
In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.
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