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Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Advanced PackagingMaterials ScienceRapid FormationEngineeringAdvanced Packaging (Semiconductors)Chip On BoardMechanical EngineeringChip AttachmentElectronic PackagingUltrasonic-assisted DieSn–0.7cu Solder