Hightec MC (Switzerland)

122-GHz chip-to-antenna wire bond interconnect with high repeatability

Stefan Beer, Heiko Gulan, Mario Pauli et al. · 2012 · 27 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +11

Flexoelectric Polarization in a Nematic Liquid Crystal Enhanced by Dopants with Different Molecular Shape Polarities

Miha Škarabot, N. J. Mottram, Supreet Kaur et al. · ACS Omega · 2022 · 24 citations · Full text

Niobium flex cable for low temperature high density interconnects

Henk J. van Weers, G. Kunkel, M. A. Lindeman et al. · Cryogenics · 2012 · 23 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +6

Self-Powered Dynamic Glazing Based on Nematic Liquid Crystals and Organic Photovoltaic Layers for Smart Window Applications

Sadiara Fall, Jing Wang, Thomas Regrettier et al. · ACS Applied Materials & Interfaces · 2023 · 15 citations

A self-compensating 130-GHz wire bond interconnect with 13% bandwidth

Stefan Beer, Christian Rusch, Benjamin Göttel et al. · 2013 · 13 citations

Experimental Results, Electrical Engineering, Millimeter Wave Technology +12