Via Planning

Via Planning is a methodological framework in interconnect design that systematically determines the placement, distribution, and configuration of vias to optimize electrical performance, manufacturability, and reliability within multilayer electronic systems.

19

Publications

934

Citations

53

Authors

19

Institutions

Publications per year

2017–2026

1

Authors

53

  1. XH
    Xianlong Hong

    Tsinghua University, China

    5 publications · 155 citations

    5

    h-index

  2. YZ
    Yan Zhang

    University of Oslo, Norway

    4 publications · 443 citations

    4

    h-index

  3. CC
    Chung‐Kuan Cheng

    University of California San Diego, United States

    4 publications · 128 citations

    4

    h-index

  4. WY
    Wenjian Yu

    Tsinghua University, China

    3 publications · 72 citations

    3

    h-index

  5. SK
    Sung Kyu Lim

    Georgia Institute of Technology, United States

    3 publications · 140 citations

    3

    h-index

1–5 of 53

Venues

  1. Design, Automation, and Test in Europe

    Conference · 1 publications · 17 citations

    1

    h-index

  2. 1

    h-index

  3. 1

    h-index

  4. 1

    h-index

  5. 1

    h-index

1–5