Concepedia

Substrate Grinding

Substrate Grinding is a material processing technique within the field of substrate preparation that involves the controlled abrasion of a surface to achieve specified flatness, roughness, and cleanliness prior to thin-film deposition or coating.

200

Publications

9.2K

Citations

622

Authors

223

Institutions

Publications per year

2017–2026

50

Parents

Publications

200

Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment

Wenwen Li, N.R. Tao, K. Lu · Scripta Materialia · 2008 · 414 citations

, , +16

Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing

H. Ohmori, Tomoyuki Nakagawa · CIRP Annals · 1990 · 331 citations

, , +16

Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

Sanjay Agarwal, P. Venkateswara Rao · International Journal of Machine Tools and Manufacture · 2007 · 326 citations

, , +17

Performance evaluation of Ti–6Al–4V grinding using chip formation and coefficient of friction under the influence of nanofluids

Dinesh Setti, Manoj Kumar Sinha, Sudarsan Ghosh et al. · International Journal of Machine Tools and Manufacture · 2014 · 287 citations

, , +12

Sensitivity of stress corrosion cracking of stainless steel to surface machining and grinding procedure

A. Turnbull, Ken Mingard, J D Lord et al. · Corrosion Science · 2011 · 233 citations

, , +16

1–5 of 200

Authors

622

  1. ZP
    Zhijian Pei

    Kansas State University, United States

    13 publications · 550 citations

    12

    h-index

  2. RK
    Renke Kang

    Dalian University of Technology, China

    10 publications · 299 citations

    10

    h-index

  3. LZ
    Libo ZHOU

    Ibaraki University, Japan

    7 publications · 377 citations

    7

    h-index

  4. JS
    Jun Shimizu

    Ibaraki University, Japan

    7 publications · 318 citations

    7

    h-index

  5. HE
    Hiroshi Eda

    Ibaraki University, Japan

    6 publications · 237 citations

    6

    h-index

1–5 of 622

Institutions

223

  1. Kansas State University

    Manhattan, United States

    14 h-index

    29 publications

    1.1K citations

  2. Dalian University of Technology

    Dalian, China

    12 h-index

    56 publications

    1.7K citations

  3. Harbin Institute of Technology

    Harbin, China

    9 h-index

    31 publications

    1.9K citations

  4. Ibaraki University

    Ibaraki, Japan

    9 h-index

    30 publications

    1.4K citations

  5. Hitachi (Japan)

    Tokyo, Japan

    8 h-index

    27 publications

    1.3K citations

  6. RIKEN

    Wako, Japan

    7 h-index

    12 publications

    948 citations

  7. SunEdison (United States)

    Belmont, United States

    6 h-index

    8 publications

    291 citations

  8. The University of Queensland

    Brisbane, Australia

    6 h-index

    11 publications

    989 citations

1–8 of 223

Venues

  1. 25

    h-index

  2. Journal of Materials Processing Technology

    16 publications · 592 citations

    15

    h-index

  3. CIRP Annals

    14 publications · 1K citations

    14

    h-index

  4. 13

    h-index

  5. Precision Engineering

    9 publications · 488 citations

    9

    h-index

1–5