Concepedia

Passive Component Modeling

Passive Component Modeling is a systematic methodology in microwave device simulation that formulates the electromagnetic and circuit-level behavior of non-active, energy-dissipating or energy-storing components to enable accurate prediction of their performance within larger integrated systems.

305

Publications

11.2K

Citations

866

Authors

334

Institutions

Publications per year

2017–2026

64

Parents

Publications

305

Artificial neural networks for rf and microwave design-from theory to practice

Qi‐Jun Zhang, K.C. Gupta, V. Devabhaktuni · IEEE Transactions on Microwave Theory and Techniques · 2003 · 724 citations

, , +17

Knowledge-based neural models for microwave design

Fang Wang, Qi‐Jun Zhang · IEEE Transactions on Microwave Theory and Techniques · 1997 · 295 citations

, , +17

Design and modelling of a fluid inerter

Stuart Swift, M. C. Smith, Andrew Glover et al. · International Journal of Control · 2013 · 272 citations

, , +12

Smart Modeling of Microwave Devices

Humayun Kabir, Lei Zhang, Ming Yu et al. · IEEE Microwave Magazine · 2010 · 219 citations

, , +17

A microwave heat transfer model for a rotating multi-component meal in a domestic oven: Development and validation

Krishnamoorthy Pitchai, Jiajia Chen, S.L. Birla et al. · Journal of Food Engineering · 2014 · 183 citations

, , +15

1–5 of 305

Authors

866

  1. QZ
    Qi‐Jun Zhang

    Carleton University, Canada

    17 publications · 1.8K citations

    14

    h-index

  2. AP
    Anna Pietrenko‐Dabrowska

    Gdańsk University of Technology, Poland

    9 publications · 141 citations

    9

    h-index

  3. FF
    Feng Feng

    Tianjin University, China

    8 publications · 343 citations

    8

    h-index

  4. MS
    Madhavan Swaminathan

    Georgia Institute of Technology, United States

    7 publications · 185 citations

    7

    h-index

  5. JZ
    Jianan Zhang

    Carleton University, Canada

    5 publications · 280 citations

    5

    h-index

1–5 of 866

Institutions

334

  1. Carleton University

    Ottawa, Canada

    18 h-index

    75 publications

    5.9K citations

  2. Georgia Institute of Technology

    Atlanta, United States

    10 h-index

    40 publications

    831 citations

  3. Gdańsk University of Technology

    Gdansk, Poland

    9 h-index

    9 publications

    141 citations

  4. Tianjin University

    Tianjin, China

    9 h-index

    19 publications

    592 citations

  5. University of California, Berkeley

    Berkeley, United States

    6 h-index

    15 publications

    598 citations

  6. Tsinghua University

    Beijing, China

    6 h-index

    21 publications

    476 citations

  7. Pamukkale University

    Denizli, Türkiye

    6 h-index

    6 publications

    249 citations

  8. Texas Instruments (United States)

    Dallas, United States

    5 h-index

    8 publications

    255 citations

1–8 of 334

Venues

  1. 22

    h-index

  2. IEEE Transactions on Power Electronics

    8 publications · 599 citations

    8

    h-index

  3. 8

    h-index

  4. IEEE Access

    5 publications · 153 citations

    5

    h-index

  5. Electrical Performance of Electronic Packaging

    Conference · 4 publications · 60 citations

    4

    h-index

1–5