Concepedia

Packaging Specifications

Packaging Specifications is a technical documentation framework that defines the standards, materials, dimensions, labeling, and regulatory requirements governing the containment, protection, and presentation of products within supply chain and manufacturing contexts.

6

Publications

142

Citations

47

Authors

7

Institutions

Publications per year

2017–2026

2

Parents

Publications

6

Functional requirement specification in the packaging development chain

Diederick Lutters, Roland ten Klooster · CIRP Annals · 2008 · 39 citations

, , +14

A 4nm 32Gb/s 8Tb/s/mm Die-to-Die Chiplet Using NRZ Single-Ended Transceiver With Equalization Schemes And Training Techniques

Kihwan Seong, Donguk Park, Gyeomje Bae et al. · 2023 · 38 citations

, , +17

An automated packaging planning approach using machine learning

Dino Knoll, Daniel Neumeier, Marco Prüglmeier et al. · Procedia CIRP · 2019 · 25 citations · Full text

, , +15

Standardisation of crates: lessons from the <i>Versfust</i> (Freshcrate) project

Hans Koehorst, Henk de Vries, E.F.M. Wubben · Supply Chain Management An International Journal · 1999 · 15 citations

, , +10

System, process, and design implications of a reduced supply voltage microprocessor

R. Allmon, B.J. Benschneider, M. B. Callander et al. · 1990 · 13 citations

, , +17

1–5 of 6

Authors

47

  1. DL
    Diederick Lutters

    University of Twente, Netherlands

    2 publications · 51 citations

    2

    h-index

  2. JO
    J.A. Oostendorp

    Royal University of Law and Economics, Cambodia

    1 publications · 12 citations

    1

    h-index

  3. DP
    Donguk Park

    Samsung (South Korea), South Korea

    1 publications · 38 citations

    1

    h-index

  4. JG
    J. Grodstein

    Digital Wave (United States), United States

    1 publications · 13 citations

    1

    h-index

  5. DK
    D. Kravitz

    Digital Wave (United States), United States

    1 publications · 13 citations

    1

    h-index

1–5 of 47

Institutions

7

  1. University of Twente

    Enschede, The Netherlands

    1 h-index

    2 publications

    78 citations

  2. BMW (Germany)

    Munich, Germany

    1 h-index

    1 publications

    25 citations

  3. Natural History Museum Rotterdam

    Rotterdam, The Netherlands

    1 h-index

    1 publications

    15 citations

  4. Samsung (South Korea)

    Seoul, South Korea

    1 h-index

    16 publications

    608 citations

  5. Digital Wave (United States)

    Centennial, United States

    1 h-index

    19 publications

    247 citations

  6. Technical University of Munich

    Munich, Germany

    1 h-index

    3 publications

    75 citations

  7. Royal University of Law and Economics

    Phnom Penh, Cambodia

    1 h-index

    1 publications

    12 citations

1–7 of 7

Venues

  1. CIRP Annals

    1 publications · 39 citations

    1

    h-index

  2. 1

    h-index

  3. University of Twente Research Information

    Repository · 1 publications · 12 citations

    1

    h-index

  4. Procedia CIRP

    1 publications · 25 citations

    1

    h-index

  5. Microelectronics International

    1 publications · 10 citations

1–5