Microelectronic Implant Packaging

Microelectronic Implant Packaging is a specialized hermetic enclosure designed to protect implantable microelectronic devices from physiological environments while ensuring electrical connectivity, biocompatibility, and long-term reliability within the human body.

Publications

471

Citations

Authors

Institutions

Publications per year

2017–2026

Parents

Implantable Microsystems

Publications

The Packaging of Implantable Integrated Sensors

Lyn Bowman, J.D. Meindl · IEEE Transactions on Biomedical Engineering · 1986 · 105 citations

Engineering, Biomedical Engineering, Materials Engineering +17

An MeV-ion implanter for large area applications

Anders Hallén, P. Anders Ingemarsson, P. Håkansson et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 1989 · 51 citations

Engineering, Biomedical Engineering, Electrical Engineering +12

Design of fractional order epidemic model for future generation tiny hardware implants

Zaheer Masood, Raza Samar, Muhammad Asif Zahoor Raja · Future Generation Computer Systems · 2020 · 32 citations

Engineering, Biomedical Engineering, Computer Engineering +13

A technology for implantable hermetic packages. Part 1: Design and materials

P. E. K. Donaldson, E. Sayer · Medical & Biological Engineering & Computing · 1981 · 31 citations

Engineering, Biomedical Engineering, Materials Engineering +12

Megaelectronvolt implantations in silicon very-large-scale integration

Atul Saxena, Dipankar Pramanik · Materials Science and Engineering B · 1989 · 29 citations

Engineering, Electrical Engineering, Electronic Materials +13

1–5 of 17

Authors

JD
James D. Weiland
University of Southern California, United States
4 publications · 58 citations
4
h-index
PE
P. E. K. Donaldson
University College London, United Kingdom
4 publications · 94 citations
4
h-index
ES
E. Sayer
Medical Research Council, United Kingdom
3 publications · 69 citations
3
h-index
MS
Mark S. Humayun
University of Southern California, United States
3 publications · 47 citations
3
h-index
JS
Juan S. Ordonez
University of Freiburg, Germany
2 publications · 35 citations
2
h-index

1–5 of 44

Institutions

1–8 of 17

Venues

Medical & Biological Engineering & Computing
4 publications · 94 citations
4
h-index
Analog Integrated Circuits and Signal Processing
1 publications · 26 citations
1
h-index
Future Generation Computer Systems
FGCS · 1 publications · 32 citations
1
h-index
Proceedings of the IEEE
1 publications · 10 citations
1
h-index
Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms
1 publications · 51 citations
1
h-index

1–5