Cooling Profile Engineering

Cooling Profile Engineering is a methodological framework in materials science that enables precise manipulation of thermal gradients and solidification kinetics during cooling processes to achieve desired microstructural and mechanical properties in engineered materials.

106

Publications

3.5K

Citations

407

Authors

134

Institutions

Publications per year

2017–2026

61

Authors

407

  1. CK
    Chil-Chyuan Kuo

    Ming Chi University of Technology, Taiwan

    4 publications · 90 citations

    4

    h-index

  2. GW
    Guodong Wang

    Northeastern University, China

    3 publications · 78 citations

    3

    h-index

  3. RA
    R. A. Turusov

    Russian Academy of Sciences, Russia

    2 publications · 20 citations

    2

    h-index

  4. JW
    Jianhua Wang

    Northeastern University, China

    2 publications · 86 citations

    2

    h-index

  5. XY
    Xi Yang

    Xi'an Jiaotong University, China

    2 publications · 32 citations

    2

    h-index

1–5 of 407

Venues

  1. 11

    h-index

  2. Applied Thermal Engineering

    9 publications · 339 citations

    10

    h-index

  3. International Journal of Thermal Sciences

    IJTS · 9 publications · 216 citations

    10

    h-index

  4. 8

    h-index

  5. Applied Energy

    3 publications · 143 citations

    3

    h-index

1–5