Cooling Profile Engineering
Cooling Profile Engineering is a methodological framework in materials science that enables precise manipulation of thermal gradients and solidification kinetics during cooling processes to achieve desired microstructural and mechanical properties in engineered materials.
106
Publications
3.5K
Citations
407
Authors
134
Institutions
Publications per year
2017–2026
61
Parents
106
Muhammad Junaid Ashraf, Hafız Muhammad Ali, Hazrat Usman et al. · International Journal of Heat and Mass Transfer · 2017 · 194 citations
Investigation on the CPU nanofluid cooling
Mohsen H. Al-Rashed, Grzegorz Dzido, Mateusz Korpyś et al. · Microelectronics Reliability · 2016 · 96 citations
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134

Northeastern University
Shenyang, China
7 h-index
33 publications
909 citations

Xi'an Jiaotong University
Xi'an, China
7 h-index
30 publications
925 citations
Ming Chi University of Technology
Taipei, Taiwan
4 h-index
21 publications
482 citations

Chinese Academy of Sciences
Beijing, China
4 h-index
12 publications
335 citations

Northwestern Polytechnical University
Xi'an, China
4 h-index
13 publications
422 citations

Nanjing University of Aeronautics and Astronautics
Nanjing, China
3 h-index
11 publications
233 citations
Russian Academy of Sciences
Moscow, Russia
2 h-index
6 publications
60 citations

Huazhong University of Science and Technology
Wuhan, China
2 h-index
14 publications
304 citations
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9 publications · 449 citations
11
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9 publications · 339 citations
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IJTS · 9 publications · 216 citations
10
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8 publications · 253 citations
8
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3 publications · 143 citations
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