Xin Tang

Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations

Yongle Huang, Hongfei Deng, Yifei Luo et al. · IEEE Transactions on Industrial Electronics · 2020 · 45 citations

Engineering, Mechanical Engineering, Reliability Engineering +20

Online Open-Circuit Fault Diagnosis for Neutral Point Clamped Inverter Based on an Improved Convolutional Neural Network and Sample Amplification Method Under Varying Operating Conditions

Haolan Shen, Xin Tang, Yifei Luo et al. · IEEE Transactions on Instrumentation and Measurement · 2024 · 20 citations

Fault Diagnosis, Electrical Engineering, Convolutional Neural Network +14

Evaluation of the Degradation in Electrothermal Characteristics of IGBTs During Thermal Cycling Cocaused by Solder Cracking and Al-Wires Lifting-Off Based on Iterative Looping

Yongle Huang, Yifei Luo, Fei Xiao et al. · IEEE Transactions on Power Electronics · 2022 · 19 citations

Dynamic Degradation, Engineering, Solder Cracking +18

Temporal and Spatial Differences in Thermal Transfer Behavior of IGBTs Caused by the Baseplate and Die-Attach Solder Cracking

Yongle Huang, Yifei Luo, Fei Xiao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2022 · 15 citations

Spatial Differences, Electrical Engineering, Solder Layers +15

Mesoporous Silica/Iron Phthalocyanine Light-Driven Nanomaterials for Efficient Removal of Pb²⁺ Ions from Wastewater

Keheng Pan, Xin Tang, Guangfei Qu et al. · ACS Applied Nano Materials · 2023 · 11 citations