Concepedia

Yongle Huang

YH

Statistics

Publications

4

Citations

88

H-Index

4

Active since

2018

Affiliations

Naval University of Engineering(Current)

Yongle Huang is an author at Naval University of Engineering specializing in microelectronics, electronic packaging, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingHeat TransferThermal EngineeringElectrical EngineeringCorrosionPower ElectronicsPhysicsMicrostructure

Publications per year

2018–2022

4

Publications

4

Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys

Yongle Huang, Yifei Luo, Fei Xiao et al. · Microelectronics Reliability · 2020 · 42 citations

Materials Science, Engineering, Hardware Reliability +10

Evaluation of the Degradation in Electrothermal Characteristics of IGBTs During Thermal Cycling Cocaused by Solder Cracking and Al-Wires Lifting-Off Based on Iterative Looping

Yongle Huang, Yifei Luo, Fei Xiao et al. · IEEE Transactions on Power Electronics · 2022 · 19 citations

Dynamic Degradation, Engineering, Solder Cracking +18

Temporal and Spatial Differences in Thermal Transfer Behavior of IGBTs Caused by the Baseplate and Die-Attach Solder Cracking

Yongle Huang, Yifei Luo, Fei Xiao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2022 · 15 citations

Spatial Differences, Electrical Engineering, Solder Layers +15

Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis

Yongle Huang, Yifei Luo, Fei Xiao et al. · Microelectronics Reliability · 2018 · 12 citations

Electrical Engineering, Cross Section, Engineering +12

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