Keith Buchanan

Low temperature PECVD of dielectric films for TSV applications

Daniel Archard, K. Giles, Andrew Price et al. · 2010 · 42 citations

Dielectrics, Engineering, Step Coverage +16

Stable, high efficiency thin film solar cells produced by electrodeposition of cadmium telluride

A. Keith Turner, J.M. Woodcock, M.E. Özsan et al. · Solar Energy Materials · 1991 · 18 citations

Materials Science, Cadmium Telluride, Electrical Engineering +5

The evolution of interconnect technology for silicon integrated circuitry.

Keith Buchanan · 2002 · 16 citations

Evaluation of Ta and TaN-based Cu diffusion barriers deposited by Advanced Hi-Fill (AHF) sputtering onto blanket wafers and high aspect ratio structures

S. Burgess, H Donohue, Keith Buchanan et al. · Microelectronic Engineering · 2002 · 15 citations

Materials Engineering, Materials Science, Electrical Engineering +11

Dielectric stack engineering for via-reveal passivation

Kath Crook, Mark Carruthers, Daniel Archard et al. · 2013 · 13 citations

Engineering, Back Side, Thin Film Process Technology +21