John Reichl

3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental Validation

John Reichl, Jose M. Ortiz-Rodriguez, Allen R. Hefner et al. · IEEE Transactions on Power Electronics · 2014 · 76 citations

Engineering, Experimental Validation, Energy Efficiency +22

High speed IGBT module transient thermal response measurements for model validation

D.W. Berning, John Reichl, Allen R. Hefner et al. · 2004 · 30 citations · Full text

Engineering, Single Igbt Chip, Power Electronics +16

Thermal component models for electro thermal analysis of multichip power modules

J.J. Rodríguez, Z. Parrilla, Miguel Vélez-Reyes et al. · Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344) · 2003 · 30 citations · Full text

Power balance control and voltage conditioning for fuel cell converter with multiple sources

C. Liu, T. Nergaard, L. Leslie et al. · 2003 · 23 citations

Electrical Engineering, Engineering, Dc Microgrids +12

Silicon Carbide JFET Cascode Switch for Power Conditioning Applications

Ty McNutt, Victor Veliadis, Eric J. Stewart et al. · 2005 · 19 citations

Low-power Electronics, Power Conditioning Applications, Electrical Engineering +11