N. T. M. Hai

Classification of suppressor additives based on synergistic and antagonistic ensemble effects

Peter Broekmann, Alexander Fluegel, Charlotte Emnet et al. · Electrochimica Acta · 2011 · 167 citations

Pharmacology, Biostatistics, Antagonistic Ensemble Effects +1

Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating

N. T. M. Hai, Truc T. Huynh, Alexander Fluegel et al. · Electrochimica Acta · 2012 · 71 citations

Materials Science, Materials Engineering, Chemical Engineering +10

Copolymers of Imidazole and 1,4-Butandiol Diglycidyl Ether as an Efficient Suppressor Additive for Copper Electroplating

N. T. M. Hai, Julien Furrer, E. Barletta et al. · Journal of The Electrochemical Society · 2014 · 43 citations

Imep Polymer, Engineering, 1,4-Butandiol Diglycidyl Ether +17

Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM

Tin Huynh, N. T. M. Hai, Peter Broekmann · Journal of The Electrochemical Society · 2013 · 41 citations

Engineering, Chemistry, Quasi-reversible Interaction +16

Phase transition in ordered porphyrin layers on iodide modified Cu(111): An EC-STM study

N. T. M. Hai, Blaženka Gašparović, K. Wandelt et al. · Surface Science · 2007 · 36 citations · Full text

Materials Science, Inorganic Chemistry, Engineering +7