J.K. Lan

X-Ray Reflectivity and FTIR Measurements of N[sub 2] Plasma Effects on the Density Profile of Hydrogen Silsesquioxane Thin Films

H. J. Lee, Eric K. Lin, Wen‐Li Wu et al. · Journal of The Electrochemical Society · 2001 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17

Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application

Yi-Lung Cheng, Yuh‐Lin Wang, C. W. Liu et al. · Thin Solid Films · 2001 · 18 citations

Engineering, Materials Engineering, Materials Science +15

Effect of carrier gas on the structure and electrical properties of low dielectric constant SiCOH film using trimethylsilane prepared by plasma enhanced chemical vapor deposition

Yulin Cheng, Y. L. Wang, J.K. Lan et al. · Thin Solid Films · 2004 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +17

Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material

Yi-Lung Cheng, Y.L. Wang, Yi-Ching Wu et al. · Thin Solid Films · 2003 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +16

Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-μm logic process

J.K. Lan, Yuh‐Lin Wang, Kai‐Ming Lo et al. · Thin Solid Films · 2001 · 11 citations

Engineering, Materials Engineering, Materials Science +9