4
Publications
193
Citations
4
H-Index
2018
Active since
Affiliations
Seongbin Shin is an author at The University of Tokyo specializing in surface science, materials science, and chemistry.
Top concepts
ChemistryCorrosionEngineeringSurface ScienceMaterial ScienceNanomanufacturingSurface ChemistrySurface EngineeringChemical EngineeringElectronic Packaging
Publications per year
2018–2019
4
4
High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces
Fengwen Mu, Zhe Cheng, Jingjing Shi et al. · ACS Applied Materials & Interfaces · 2019 · 145 citations
Low temperature Cu bonding with large tolerance of surface oxidation
Hui Ren, Fengwen Mu, Seongbin Shin et al. · AIP Advances · 2019 · 20 citations · Full text
Patient consent to publication and data sharing in industry and NIH-funded clinical trials
O’Mareen Spence, Richie Onwuchekwa Uba, Seongbin Shin et al. · Trials · 2018 · 18 citations · Full text
Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor
Fengwen Mu, Yang Xu, Seongbin Shin et al. · Micromachines · 2019 · 10 citations · Full text
Rows per page
1–4 of 4