P.C. Chang

Effect of solder creep on the reliability of large area die attachment

Wuhao Zhuang, P.C. Chang, Frank Chou et al. · Microelectronics Reliability · 2001 · 59 citations

Engineering, Hardware Reliability, Mechanical Engineering +4

Anomalous transport and thermal properties of NiTi and with Cu and Fe-doped shape memory alloys near the martensitic transition

Babita Ingale, Wu Wei, P.C. Chang et al. · Journal of Applied Physics · 2011 · 45 citations

Magnetic Properties, Engineering, Thermal Conductivity +19

Cu-substitution effect on thermoelectric properties of the TiNi-based shape memory alloys

B. Ramachandran, R. C. Tang, P.C. Chang et al. · Journal of Applied Physics · 2013 · 33 citations

Cu-substitution Effect, Magnetic Properties, Engineering +18

Thermal and transport properties of as-grown Ni-rich TiNi shape memory alloys

B. Ramachandran, C.H. Chen, P.C. Chang et al. · Intermetallics · 2015 · 24 citations

Materials Engineering, Materials Science, Engineering +7

Spin-phonon interactions of multiferroic Bi4Ti3O12-BiFeO3 ceramics: Low-temperature Raman scattering and infrared reflectance spectra investigations

Ping Jiang, X. L. Zhang, P.C. Chang et al. · Journal of Applied Physics · 2014 · 23 citations

Spin-phonon Interactions, Engineering, Magnetic Resonance +19