Design, fabrication and characterization of metal embedded thin film thermocouples with various film thicknesses and junction sizes

Xugang Zhang, Hongseok Choi, Arindom Datta, +1

Journal of Micromechanics and Microengineering

EngineeringThin Film Process TechnologyJunction SizesThin Film ThermocouplesSensor Technology +25

Are Diamonds a MEMS' Best Friend?

Orlando Auciello, Sergio Pacheco, Anirudha V. Sumant, +12

IEEE Microwave Magazine

EngineeringRadio FrequencyOscillatorsBest FriendMicroelectromechanical Systems +19

Improved diffusion barrier by stuffing the grain boundaries of TiN with a thin Al interlayer for Cu metallization

Ki Tae Nam, Arindom Datta, Soo‐Hyun Kim, +1

Applied Physics Letters

Materials ScienceMaterials EngineeringEngineeringDiffusion ResistanceParent Barrier Layer +13

Nanofluidic channels by anodic bonding of amorphous silicon to glass to study ion-accumulation and ion-depletion effect

Arindom Datta, Shubhra Gangopadhyay, H. Temkin, +2

Talanta

Materials ScienceIon ImplantationEngineeringMicrofabricationNanotechnology +10

Study on Embedding and Integration of Microsensors Into Metal Structures for Manufacturing Applications

Xudong Cheng, Arindom Datta, Hongseok Choi, +2

Journal of Manufacturing Science and Engineering

EngineeringMechanical EngineeringReal Time MonitoringWire Arc Additive ManufacturingSensor Technology +14

Multilayer diffusion barrier for copper metallization using a thin interlayer metal (M=Ru, Cr, and Zr) between two TiN films

Soo‐Hyun Kim, Ki Tae Nam, Arindom Datta, +3

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

EngineeringChemical DepositionSemiconductorsDiffusion BarrierThin Film Processing +15

Batch Fabrication and Characterization of Micro-Thin-Film Thermocouples Embedded in Metal

Arindom Datta, Hongseok Choi, Xiaochun Li

Journal of The Electrochemical Society

EngineeringMicro-thin-film SensorsThin Film Process TechnologyFlexible SensorElectronic Packaging +14

Optimization of Al interlayer thickness for the multilayer diffusion barrier scheme in Cu metallization

Arindom Datta, Ki Tae Nam, Soo‐Hyun Kim, +1

Journal of Applied Physics

Aluminium NitrideEngineeringThin Film Process TechnologySequential SputteringThin Film Processing +16

Failure mechanism of a multilayer (TiN/Al/TiN) diffusion barrier between copper and silicon

Soo‐Hyun Kim, Ki Tae Nam, Arindom Datta, +1

Journal of Applied Physics

EngineeringUpper Tin FilmThin Film Process TechnologyNanoelectronicsFailure Mechanism +17

Are Diamonds a MEMS' Best Friend?

Orlando Auciello, Sergio Pacheco, Anirudha V. Sumant, +12

IEEE Microwave Magazine

Diamond-like CarbonBest Friend