J. S. Chun - Concepedia

Author

J. S. Chun

Korea Advanced Institute of Science and Technology

Also Known As

Chun, Jieun, J S Chun, J. S. Chun, J.-S. Chun, J.S. Chun

Publications

456

Citations

H-Index

Concepts

All Affiliations

Korea Advanced Institute of Science and Technology University of Illinois Urbana-Champaign IBM Research - Thomas J. Watson Research Center University of Utah

About

J. S. Chun is an author at Korea Advanced Institute of Science and Technology specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	13	443
2	Applied Physics	10	10	313
3	Chemical Engineering	5	5	90
4	Materials Engineering	5	5	99
5	Chemistry	2	2	49

J. S. Chun

Publications

443

Citations

H-Index

Page 1

	Year	Citations
Dense fully 111-textured TiN diffusion barriers: Enhanced lifetime through microstructure control during layer growth J. S. Chun, I. Petrov, J. E. Greene Journal of Applied Physics Magnetic PropertiesEngineeringThin Film Process TechnologyReactive EvaporationChemical Deposition	1999	123
Precipitate strengthening mechanisms in magnesium zinc alloy single crystals J. S. Chun, J. G. Byrne Journal of Materials Science Materials ScienceEngineeringCorrosionMagnesium-based CompositeMicrostructure	1969	104
The inhibition of deformation twinning by precipitates in a magnesium-zinc alloy J. S. Chun, J. G. Byrne, Alfred Bornemann Philosophical magazine Single CrystalsEngineeringSevere Plastic DeformationMechanical EngineeringGrain Size	1969	44
Crystallographic Orientation and Surface Morphology of Chemical Vapor Deposited Al2 O 3 Choon‐Sik Park, Ji-Bum Kim, J. S. Chun Journal of The Electrochemical Society Aluminium NitrideEngineeringChemistryChemical DepositionChemical Engineering	1983	35
Interfacial reactions in epitaxial Al/TiN(111) model diffusion barriers: Formation of an impervious self-limited wurtzite-structure AIN(0001) blocking layer J. S. Chun, P. Desjardins, C. Lavoie, Journal of Applied Physics Aluminium NitrideInterfacial ReactionsEngineeringChemical DepositionSingle-crystal Tin	2001	23
Interfacial reaction pathways and kinetics during annealing of epitaxial Al/TiN(001) model diffusion barrier systems J. S. Chun, P. Desjardins, I. Petrov, Thin Solid Films Materials ScienceEpitaxial Al/tinAluminium NitrideEngineeringDiffusion Resistance	2001	18
Synchrotron x-ray diffraction and transmission electron microscopy studies of interfacial reaction paths and kinetics during annealing of fully-002-textured Al/TiN bilayers J. S. Chun, J. R. A. Carlsson, P. Desjardins, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Aluminium NitrideMagnetic Properties002-Textured BilayersEngineeringUltrahigh Vacuum	2001	18
Effects of the deposition temperature on the resistivity of copper films produced by low-pressure metal-organic chemical vapour deposition on a TiN barrier layer Seong‐Sik Yoon, Jeong Su Min, J. S. Chun Journal of Materials Science Materials ScienceMaterials EngineeringChemical EngineeringEngineeringSpecific Resistance	1995	16
Chemical Vapor Deposition J. S. Chun Chemical EngineeringEngineeringSurface ScienceChemistryChemical Deposition	1971	14
Corrosion behaviour of TiN films obtained by plasma-assisted chemical vapour deposition Chi-Bum In, S. P. Kim, J. S. Chun Journal of Materials Science Materials ScienceMaterials EngineeringChemical EngineeringTin FilmsEngineering	1994	13

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