Mosin Mondal

Thermally robust clocking schemes for 3D integrated circuits

Mosin Mondal, Andrew J. Ricketts, Sami Kirolos et al. · Design, Automation, and Test in Europe · 2007 · 73 citations

Engineering, Vlsi Design, Computer Architecture +17

Expression of Concern: Provisioning On-Chip Networks under Buffered RC Interconnect Delay Variations

Mosin Mondal, Tamer Ragheb, Xiang Wu et al. · 2007 · 59 citations

Engineering, Noc Applications, Computer Architecture +16

Expression of Concern: Thermally Robust Clocking Schemes for 3D Integrated Circuits

Mosin Mondal, Andrew J. Ricketts, Sami Kirolos et al. · 2007 · 58 citations

Engineering, Vlsi Design, Computer Architecture +19

Expression of Concern: Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect

Arthur Nieuwoudt, Mosin Mondal, Yehia Massoud · 2007 · 55 citations

Carbon Nanotube Bundles, Vlsi Design, Engineering +21

Reducing pessimism in RLC delay estimation using an accurate analytical frequency dependent model for inductance

Mosin Mondal, Yehia Massoud · International Conference on Computer Aided Design · 2005 · 43 citations

Electrical Engineering, Physical Design (Electronics), Engineering +15