Tao-Chih Chang

A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps

Yuan-Wei Chang, Chia-chia Hu, Hsin-Ying Peng et al. · Scientific Reports · 2018 · 71 citations · Full text

Engineering, Electrical Engineering, Materials Science +13

Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits

Hsueh-Hsien Hsu, Shin-Yi Huang, Tao-Chih Chang et al. · Applied Physics Letters · 2011 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +16

Precipitation behavior of σ phase in fusion zone of dissimilar stainless steel welds during multi-pass GTAW process

Chih-Chun Hsieh, Tao-Chih Chang, Dong-Yih Lin et al. · Metals and Materials International · 2007 · 16 citations

Engineering, Materials Engineering, Materials Science +15

The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

Christine Jill Lee, Wei‐Yu Chen, Tzu-Ting Chou et al. · Journal of Materials Science Materials in Electronics · 2015 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +17